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ISL29001
Data Sheet February 8, 2007 FN6166.5
Light-to-Digital Sensor
The ISL29001 is an integrated ambient light sensor with ADC and I2C interface. With a spectral sensitivity curve matched to that of the human eye, the ISL29001 provides 15-bit effective resolution while rejecting 50Hz and 60Hz flicker caused by artificial light sources. In normal operation, the ISL29001 consumes less than 300A of supply current. A software power-down mode controlled via the I2C interface disables all but the I2C interface. A power-down pin is also provided, which reduces power consumption to less than 1A. The ISL29001 includes an internal oscillator, which provides 100ms automatic integration periods, or can be externally timed by I2C commands. Both the internal timing and the illuminance resolution can be adjusted with an external resistor. Designed to operate on supplies from 2.5V to 3.3V, the ISL29001 is specified for operation over the -40C to +85C ambient temperature range. It is packaged in a clear 6 Ld ODFN package.
Features
* Human eye response * Temperature compensated * IR rejection * 15-bit effective resolution * Adjustable resolution: 3 counts to 15 counts per lux * Simple output code, directly proportional to lux * 0.3lux to10,000lux range * 50Hz/60Hz rejection * I2C interface * 2.5V to 3.3V supply * 6 Ld ODFN (2.1mmx2mm) * Pb-free plus anneal available (RoHS compliant)
Applications
* Ambient light sensing * Ambient backlight control
Ordering Information
PART NUMBER (Note) ISL29001IROZ ISL29001IROZ-T7 TAPE & REEL 7" PACKAGE (Pb-free) 6 Ld ODFN 6 Ld ODFN PKG. DWG. # L6.2x2.1 L6.2x2.1
* Temperature control systems * Contrast control * Camera light meters * Lighting controls * HVAC
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Block Diagram
VDD 1 PHOTODIODE 1 PD 4
Pinout
ISL29001 (6 LD ODFN) TOP VIEW
VDD 1 GND 2 REXT 3
THERMAL PAD
MUX INTEGRATING ADC
COMMAND REGISTER DATA REGISTER 5 PHOTODIODE 2 I2C 6 SDA IREF FOSC 216 COUNTER SCL
6 SDA 5 SCL 4 PD
3 REXT
2 GND
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2005-2007. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.
ISL29001
Absolute Maximum Ratings (TA = +25C)
Maximum Supply Voltage between VDD and GND . . . . . . . . . . 3.6V I2C Bus Pin Voltage (SCL, SDA) . . . . . . . . . . . . . . . . . -0.2V to 5.5V I2C Bus Pin Current (SCL, SDA) . . . . . . . . . . . . . . . . . . . . . . <10mA REXT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 3.6V Operating Temperature . . . . . . . . . . . . . . . . . . . . . . .-45C to +85C Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-45C to +100C ESD Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER VDD IDD IDD1 IDD2 FUPD fosc FI2C DATA0 DATA1 DATA2 DATA3 VREF VTL VTH ISDA IPD ton toff NOTES: 1. See Principle of Operation
VDD = 3V, TA = +25C, REXT = 100k, internally controlled integration timing (Note 1), unless otherwise specified. CONDITION MIN 2.25 0.28 Software disabled PD = 3V Mode 1 and Mode 2 (Note 2) 85 105 312 (Note 3) Ev = 0lux Full scale ADC count value Ev = 300lux, fluorescent light, Mode 1 (Note 4) Ev = 300lux, fluorescent light, Mode 2 (Note 4) 0.487 (Note 5) (Note 5) 3 PD = VDD PD = HI to LO PD = LO to HI 738 983 98 0.51 1.05 1.95 5 0.1 2 50 0.533 1 400 1 32768 1254 0.09 TYP MAX 3.63 0.33 0.10 0.5 126 UNIT V mA mA A ms kHz kHz Counts Counts Counts Counts V V V mA A s ns
DESCRIPTION Power Supply Range Supply Current Supply Current Supply Current Internal Update Time Internal Oscillator Frequency I2C Clock Rate ADC Code ADC Code ADC Code ADC Code Voltage of REXT Pin SCL and SDA Threshold LO SCL and SDA Threshold HI SDA Current Sinking Capability PD Pin Leakage Current Enable Time Disable Time
2. There are three modes of the ADC's operations. In Mode 1, the ADC integrates the current of the photodiode which is sensitive to visible and infrared light. In Mode 2, the ADC integrates the current of the photodiode which is sensitive only to infrared light. 3. Minimum I2C Clock Rate is guaranteed by design. 4. Fluorescent light is substituted by an LED at production. 5. The voltage threshold levels of the SDA and SCL pins are VDD dependent: VTL = 0.35*VDD. VTH = 0.65*VDD.
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ISL29001 Pin Descriptions
PIN NUMBER 1 2 3 PIN NAME VDD GND REXT DESCRIPTION Positive supply. Connect this pin to a clean 2.5V to 3.3V supply. Ground pin. The thermal pad is connected to the GND pin. External resistor pin is for the ADC reference current, the integration time adjustment in internal timing mode, and lux range/resolution adjustment. 100k 1% tolerance resistor recommended. Power-down pin. This pin is active-high. Applying a logic "high" to this pin will put the device into power down mode. I2C serial clock I2C serial data The I2C bus lines can bpulled above VDD, 5.5V max.
4 5 6
PD SCL SDA
Typical Performance Curves REXT = 100k
320 TA = +27C COMMAND = 00H 5000lux 292 10 OUTPUT CODE (COUNTS) TA = +27C COMMAND = 00H 0lux
SUPPLY CURRENT (mA)
306
8
6
278 200lux 264
4
2
250 2.0
2.3
2.6
2.9
3.2
3.5
3.8
0 2.0
2.3
2.6
2.9
3.2
3.5
3.8
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 1. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 2. OUTPUT CODE FOR 0LUX vs SUPPLY VOLTAGE
1.015 OSCILLATOR FREQUENCY (kHz) TA = +27C COMMAND = 00H OUTPUT CODE RATIO (% FROM 3V) 1.010 5000lux
320.0 TA = +27C 319.5
1.005
319.0
1.000 200lux 0.995
318.5
0.990 2.0
2.3
2.6
2.9
3.2
3.5
3.8
318.0
2.0
2.3
2.6
2.9
3.2
3.5
3.8
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 3. OUTPUT CODE vs SUPPLY VOLTAGE
FIGURE 4. OSCILLATOR FREQUENCY vs SUPPLY VOLTAGE
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ISL29001 Typical Performance Curves REXT = 100k
315 VDD = 3V COMMAND = 00H SUPPLY CURRENT (A) 305 5000lux 295
(Continued)
10 OUTPUT CODE (COUNTS) VDD = 3V COMMAND = 00H 0lux
8
6
285 200lux 275
4
2
265 -60
-20
20 TEMPERATURE (C)
60
100
0 -60
-20
20 TEMPERATURE (C)
60
100
FIGURE 5. SUPPLY CURRENT vs TEMPERATURE
FIGURE 6. OUTPUT CODE FOR 0LUX vs TEMPERATURE
1.080 OSCILLATOR FREQUENCY (kHz) VDD = 3V COMMAND = 00H OUTPUT CODE RATIO (% FROM +25C) 1.048
330 VDD = 3V 329
1.016
5000lux 200lux
328
0.984
327
0.952
326
0.920 -60
-20
20 TEMPERATURE (C)
60
100
325 -60
-20
20 TEMPERATURE (C)
60
100
FIGURE 7. OUTPUT CODE vs TEMPERATURE
FIGURE 8. OSCILLATOR FREQUENCY vs TEMPERATURE
100 NORMALIZED RESPONSE (%) 80 60 40
k = 7.5 n = 1.85
HUMAN VISIBILITY CIE STANDARD n(D1-kD2) NORMALIZED D2 NORMALIZED LUMINOSITY 30 ANGLE 40 50 60 70
RADIATION PATTERN
20 10 0 10 20 30 40 50 60 70 80 90 0.2 0.4 0.6 0.8 1.0 RELATIVE SENSITIVITY
D1 NORMALIZED
20 0 300
80 90 400 500 600 700 800 900 1000 1100
WAVELENGTH (nm)
FIGURE 9. SPECTRAL RESPONSE
FIGURE 10. RADIATION PATTERN
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ISL29001 Principles of Operation
Photodiodes and ADC
The ISL29001 contains two photodiodes. One of the photodiodes is sensitive to visible and infrared light (Diode 1) while the other diode (Diode 2) is used for temperature compensation (leakage current cancellation) and IR rejection. The ISL29001 also contains an on-chip integrating analog-to-digital converter (ADC) to convert photodiode currents into digital data. The ADC has three operating modes with two timing controls. (Please consult Table 1 for a complete list of modes.) In the first operating mode, the ADC only integrates Diode 1's current, and the digital output format is 16-bit unsigned-magnitude. In second operating mode, the ADC's operation is the same, except Diode 2's current is integrated. In the third operating mode, the ADC integrates Diode 2's current first, then Diode 1's current. The total integration time is doubled, and the digital output is the difference of the two photodiode currents (Diode 1's current - Diode 2's current). In this mode, the digital output format is 16-bit 2's-complement. Any of the three operating modes can be used with either of the two timing controls (either internally or externally controlled integration timing). The interface to the ADC is implemented using the standard I2C interface. Every I2C transaction ends with the master asserting a stop condition (SDA rising while SCL remains high).
I2C Transaction Flow
To WRITE, the master sends slave address 44(hex) plus the write bit. Then master sends the ADC command to the device which defines its operation. As soon as the ISL29001 receives the ADC command, it will execute and then store the readings in the register after the analog-to-digital conversion is complete. While the ISL29001 is executing the command and also after the execution, the I2C bus is available for transactions other than the ISL29001. After command execution, sensor data readings are stored in the registers. Note that if a READ is received before the execution is finished, the data retrieved is previous data sensor reading. Typical integration/conversion time is 100ms (for REXT = 100k and internal timing mode). It is recommended that a READ is sent 120ms later because the fosc variation is 20%. The operation of the device does not change until the command register is overwritten. Hence, when the master sends a slave address 44(hex) and a write bit, the ISL29001 will repeat the same command from the previous WRITE transaction. To READ, master sends slave address 44(hex) plus the read bit. Then ISL29001 will hold the SDA line to send data to master. Note that the master need not send an address register to access the data. As soon as the ISL29001 receives the read bit. It will send 4 bytes. The 1st byte is the LSB of the sensor reading. The 2nd byte is the MSB of the sensor reading. The 3rd byte is LSB of the counter reading. The 4th byte is the MSB of the counter reading. If internal timing mode is selected, only the 1st and 2nd data byte are necessary; the master can assert a stop after the 2nd data byte is received. For more information about the I2C standard, please consult the Philips(R) I2C specification documents.
I2C Interface
The ISL29001 contains a single 8-bit command register that can be written via the I2C interface. The command register defines the operation of the device, which does not change until the command register is overwritten. The ISL29001 contains four 8-bit data registers that can be read via the I2C interface. The first two data registers contain the ADC's latest digital output, while the second two registers contain the number of clock cycles in the previous integration period. The ISL29001's I2C address is hardwired internally as 1000100. Figure 11A shows a write timing diagram sample. Figure 11B shows a sample two-byte read. The I2C bus master always drives the SCL (clock) line, while either the master or the slave can drive the SDA (data) line. Every I2C transaction begins with the master asserting a start condition (SDA falling while SCL remains high). The following byte is driven by the master, and includes the slave address and read/write bit. The receiving device is responsible for pulling SDA low during the acknowledgement period. Any writes to the ISL29001 overwrite the command register, changing the device's mode. Any reads from the ISL29001 return two or four bytes of sensor data and counter value, depending upon the operating mode. Neither the command register nor the data registers have internal addresses, and none of the registers can be individually addressed.
Command Register
The command register is used to define the ADC's operations. Table 1 shows the primary commands used to control the ADC. Note that there are two classes of operating commands: three for internal timing, and three for external (arbitrary) timing. When using any of the three internal timing commands, the device self-times each conversion, which is nominally 100ms (with REXT = 100k). When using any of the three external timing commands, each command received by the device ends one conversion and begins another. The integration time of the device is thus the time between one I2C external timing command and the next. The integration time can be between 1ms and 100ms. The external timing commands can be used to synchronize the ADC's integrating time to a PWM dimming frequency in a backlight system in order to eliminate noise.
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ISL29001
TABLE 1. COMMAND REGISTERS AND FUNCTIONS COMMAND 8cH 0cH 00H 04H 08H 30H 34H 38H 1xxx_xxxxB ADC is powered-down. ADC is reset. ADC converts Diode 1's current (IDIODE1) into unsigned-magnitude 16-bit data. The integration is internally timed at 100ms per integration. ADC converts Diode 2's current (IDIODE2) into unsigned-magnitude 16-bit data. The integration is internally timed at 100ms per integration. ADC converts IDIODE1-IDIODE2 into 2's-complement 16-bit data. The total integration is internally timed at 200ms per integration. ADC converts Diode 1's current (IDIODE1) into unsigned-magnitude 16-bit data. The integration is externally timed; each 30H command sent to the device ends one integration period and begins another. ADC converts Diode 2's current (IDIODE1) into unsigned-magnitude 16-bit data. The integration is externally timed; each 34H command sent to the device ends one integration period and begins another. ADC converts IDIODE1-IDIODE2 into 2's-complement 16-bit data. The integration is externally timed; each 38H command sent to the device ends one integration period and begins another. I2C communication test. The value written to the command register can be read back via the I2C bus. FUNCTION
I2C DATA
START
DEVICE ADDRESS 44(HEX) W
A
POWER DOWN CMD 8C(HEX)
A
STOP
I2C SDA IN
A6 A5 A4 A3 A2 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0
A
I2C SDA OUT
SDA DRIVEN BY MASTER
A
SDA DRIVEN BY MASTER
A
I2C CLK IN
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
FIGURE 11A. I2C WRITE TIMING DIAGRAM SAMPLE
I2C DATA
START
DEVICE ADDRESS 44(HEX) R/W A
LSB OF SENSOR READING
A
MSB OF SENSOR READING
STOP
I2C SDA IN
A6 A5 A4 A3 A2 A1 A0 R
A
SDA DRIVEN BY ISL29001
A
SDA DRIVEN BY ISL29001
A
I2C SDA OUT
SDA DRIVEN BY MASTER
A D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 A
I2C CLK IN
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
FIGURE 11B. I2C READ TIMING DIAGRAM SAMPLE FIGURE 11.
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ISL29001
Data Registers
The ISL29001 contains four 8-bit data registers. These registers cannot be specifically addressed, as is conventional with other I2C peripherals; instead, performing a read operation on the device always returns all available registers in ascending order. See Table 2 for a description of each register.
TABLE 2. DATA REGISTERS ADDRESS 00H 01H 02H 03H CONTENTS Least-significant byte of most recent sensor reading. Most-significant byte of most recent sensor reading. Least-significant byte of integration counter value corresponding to most recent sensor reading. Most-significant byte of integration counter value corresponding to most recent sensor reading.
The full scale range in lux, FSR, is also scaled by REXT.
100k FSR = 10000lux ----------------R ext (EQ. 3)
REXT is nominally 100k, and provides 100ms internal timing and a 1 to 10,000lux range for Diode 1. Doubling this resistor value to 200k halves the internal oscillator frequency, providing 200ms internal timing. In addition, the maximum lux range of Diode 1 is also halved, from 10,000lux to 5,000lux, and the resolution is doubled, from 3.3 counts per lux to 6.6 counts per lux. The acceptable range of this resistor is 50k (providing 50ms internal timing, 20,000lux maximum reading, ~1.6 counts per lux) to 500k (500ms internal timing, 2,000lux maximum reading, ~16 counts per lux).
TABLE 3. REXT RESISTOR SELECTION GUIDE REXT (k) 50 (Min) 100 Recommended 200 500 (Max) INTEGRATION LUX RANGE RESOLUTION, TIME (ms) (lux) COUNTS/LUX 50 100 200 500 20,000 10,000 5,000 2,000 1.6 3 6 16
The first two 8-bit data registers contain the most recent sensor reading. The meaning of the specific value stored in these data registers depends on the command written via the I2C interface; see Table 1 for information on the various commands. The first byte read over the I2C interface is the least-significant byte; the second is the most significant. This byte ordering is often called "little-endian" ordering. The third and fourth 8-bit data registers contain the integration counter value corresponding to the most recent sensor reading. The ISL29001 includes a free-running oscillator, each cycle of which increments a 16-bit counter. At the end of each integration period, the value of this counter is made available in these two 8-bit registers. Like the sensor reading, the integration counter value is read across the I2C bus in little-endian order. Note that the integration counter value is only available when using one of the three externally-timed operating modes; when using internally-timed modes, the device will NAK after the two-byte sensor reading has been read.
When using one of the three internal timing modes, the ISL29001's resolution is determined by the ratio of the max lux range to 32,768, the number of clock cycles per integration. The following equations describe the light intensity as a function of the sensor reading, and as a function of the external resistor.
FSR E ( Lux ) = --------------- Data1 32768 1 10, 000lux E ( Lux ) = --------------- --------------------------------------- Data1 32768 ( R ext 100k ) (EQ. 4)
Internal Timing
When using one of the three internal timing modes, each integration period of the ISL29001 is timed by 32,768 clock cycles of an internal oscillator. The nominal frequency of the internal oscillator is 327.6kHz, which provides 100ms internally-timed integration periods. The oscillator frequency is dependent upon an external resistor, REXT, and can be adjusted by selecting a different resistor value. The resolution and maximum range of the device are also affected by changes in REXT; see below. The oscillator frequency can be calculated with the following equation:
100k f osc = 327.6kHz ----------------R ext (EQ. 1)
where E is the measured light intensity, Data1 is the sensor reading, and REXT is external resistor value.
External Timing
When using one of the three external timing modes, each integration period of the ISL29001 is determined by the time which passes between consecutive external timing commands received over the I2C bus. The user starts the integration by sending an external command and stops the integration by sending another external command. The integration time, tint, therefore is determined by the following equation:
i I2C t int = ---------f I2C (EQ. 5)
Accordingly, the integration time, tint, is also a function of REXT.
R ext t int = 100ms ----------------100k (EQ. 2)
where: iI2C is the number of I2C clock cycles to obtain the tint. fI2C is the I2C operating frequency
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The internal oscillator, fosc, operates identically in both the internal and external timing modes, with the same dependence on REXT. However, when using one of the three external timing modes, the number of clock cycles per integration is no longer fixed at 32,768, but varies with the chosen integration time, and is limited to 65,536. In order to avoid erroneous lux readings the integration must be short enough not to allow an overflow in the counter register.
65,536 t int < ----------------f OSC (EQ. 6)
Solution 1 - Using Internal Timing tint = n(1/60Hz) = m(1/50Hz). In order to achieve both 60Hz and 50Hz AC rejection, the integration time needs to be adjusted to coincide with an integer multiple of the AC noise cycle times. n/m = 60Hz/50Hz = 6/5. The first instance of integer values at which tint rejects both 60Hz and 50Hz is when m = 5, and n = 6. tint = 6(1/60Hz) = 5(1/50Hz) = 100ms From Equation 3: REXT = tint * (100k/100ms) = 100k. By populating REXT = 100k, the ISL29001 defaults to 100ms integration time and will reject the presence of both 60Hz and 50Hz power line signals. Solution 2 - Using External Timing From solution 1, the desired integration time is 100ms. Note that the REXT resistor does not determine the integration time when using external timing mode. Instead, the integration and the 16-bit counter starts when an external timing mode command is sent and end when another external timing mode is sent. In other words, the time between two external timing mode command is the integration time. The programmer determines how many clock cycles to wait between two external timing commands. iI2C = fI2C * tint, where iI2C = number of I2C cycles iI2C = 10kHz *100ms iI2C = 1,000 I2C clock cycles. An external timing command 1,000 cycles after another external timing command rejects both 60Hz and 50Hz AC noise signals.
where: tint = user defined integration time fosc = 327.6kHz*100k/REXT. ISL29001's internal oscillator. Not to be confused with the I2C's frequency. REXT = user defined external resistor to adjust fosc. 100k recommended. The number of clock cycles in the previous integration period is provided in the third and fourth bytes of data read across the I2C bus. This two-byte value is called the integration counter value. When using one of the three external timing modes, the ISL29001's resolution varies with the integration time. The resolution is determined by the ratio of the max lux range to the number of clock cycles per integration. The following equations describe the light intensity as a function of sensor reading, integration counter value, and integration time:
Data1 10, 000lux E ( Lux ) = -------------------------------------- ----------------( R ext 100k ) Data2 (EQ. 7)
where E is the measured light intensity, Data1 is the sensor reading, Data2 is the integration counter value, t is the integration time, and REXT is external resistor value.
IR Rejection
Any filament type light source has a high presence of infrared component invisible to the human eye. A white fluorescent lamp, on the other hand has a low IR content. As a result, output sensitivity may vary depending on the light source. Maximum attenuation of IR can be achieved by properly scaling the readings of Diode1 and Diode2. The user obtains data reading from sensor diode 1, D1, which is sensitive to visible and IR, then reading from sensor diode 2, D2 which is mostly sensitive from IR. The graph on Figure 9 shows the effective spectral response after applying Equation 8 of the ISL29001 from 400nm to 1000nm. The equation below describes the method of cancelling IR in internal timing mode.
D 3 = n ( D 1 - kD 2 ) (EQ. 8)
Noise Rejection and Integration Time
In general, integrating type ADC's have an excellent noiserejection characteristics for periodic noise sources whose frequency is an integer multiple of the integration time. For instance, a 60Hz AC unwanted signal's sum from 0ms to n*16.66ms (n = 1,2...ni) is zero. Similarly, setting the ISL29001's integration time to an integer multiple of periodic noise signal greatly improves the light sensor output signal in the presence of noise. The integration time, tint, of the ISL29002 is set by an external resistor REXT. See Equation 3. Design Example 1 Using the ISL29001, determine a suitable integration time, tint, that will ignore the presence of both 60Hz and 50Hz noise. Accordingly, specify the REXT value. Given that the I2C clock is at fI2C = 10kHz.
Where: data = lux amount in number of counts less IR presence D1 = data reading of Diode 1 D2 = data reading of Diode 2
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n = 1.85. This is a fudge factor to scale back the sensitivity up to ensure Equation 4 is valid. k = 7.5. This is a scaling factor for the IR sensitive Diode 2.
TABLE 4. RECOMMENDED DIMENSIONS FOR A FLAT WINDOW DESIGN DTOTAL 1.5 2.0 2.5 3.0 3.5 t=1 D1 DLENS DTOTAL D1 0.50 1.00 1.50 2.00 2.50 DLENS @ 35 VIEWING ANGLE 2.25 3.00 3.75 4.30 5.00 DLENS @ 45 VIEWING ANGLE 3.75 4.75 5.75 6.75 7.75
Flat Window Lens Design
A window lens will surely limit the viewing angle of the ISL29001. The window lens should be placed directly on top of the ISL29001. The thickness of the lens should be kept at minimum to minimize loss of power due to reflection and also to minimize loss of loss due to absorption of energy in the plastic material. A thickness of t = 1mm is recommended for a window lens design. The bigger the diameter of the window lens the wider the viewing angle is of the ISL29001. Table 4 shows the recommended dimensions of the optical window to ensure both 35 and 45 viewing angle. These dimensions are based on a window lens thickness of 1.0mm and a refractive index of 1.59.
WINDOW LENS
Thickness of lens Distance between ISL29001 and inner edge of lens Diameter of lens Distance constraint between the ISL29001 and lens outer edge
* All dimensions are in mm.
Window with Light Guide Design
If a smaller window is desired while maintaining a wide effective viewing angle of the ISL29001, a cylindrical piece of transparent plastic is needed to trap the light and then focus and guide the light on to the ISL29001. Hence the name light guide or also known as light pipe. The pipe should be placed directly on top of the ISL29001 with a distance of D1 = 0.5mm to achieve peak performance. The light pipe should have minimum of 1.5mm in diameter to ensure that whole area of the sensor will be exposed. See Figure 13.
t
DTOTAL D1
ISL29001
DLENS
= Viewing angle
FIGURE 12. FLAT WINDOW LENS
DLENS
D2 > 1.5mm LIGHT PIPE
t D2 DLENS
L
ISL29001
FIGURE 13. WINDOW WITH LIGHT GUIDE/PIPE
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Typical Circuit
A typical application circuit is shown in Figure 14.
ISL29002 2.5V TO 3.3V + 4.7F 0.1F VDD SDA SCL
MICROCONTROLLER SDA SCL
ISL29001
VSS PD REXT
100k
FIGURE 14. TYPICAL CIRCUIT
Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence with package pads. The large, exposed central die-mounting paddle in the center of the package requires neither thermal nor electrical connection to the PCB, and such connection should be avoided.
Soldering Considerations
Convection heating is recommended for reflow soldering; direct-infrared heating is not recommended. The ISL29001's plastic ODFN package does not require a custom reflow soldering profile, and is qualified to +260C. A standard reflow soldering profile with a +260C maximum is recommended.
Layout Considerations
The ISL29001 is relatively insensitive to layout. Like other I2C devices, it is intended to provide excellent performance even in significantly noisy environments. There are only a few considerations that will ensure best performance. Route the supply and I2C traces as far as possible from all sources of noise. Use two power-supply decoupling capacitors, 4.7F and 0.1F, placed close to the device.
Special Handling
ODFN6 is rated as JEDEC moisture level 4. Standard JEDEC Level 4 procedure should be followed: 72hr floor life at less than +30C 60% RH. When baking the device, the temperature required is +110C or less due to special molding compound.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 10
FN6166.5 February 8, 2007
ISL29001
Package Outline Drawing
L6.2x2.1
6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 0, 9/06
2.10 A
6 PIN 1 INDEX AREA
B
1
6 PIN 1 INDEX AREA 0.65 2.00
1 . 35
1 . 30 REF
(4X)
0.10
6X 0 . 30 0 . 05
0 . 65
TOP VIEW
0.10 M C A B 6X 0 . 35 0 . 05
BOTTOM VIEW
(0 . 65) MAX 0.75 SEE DETAIL "X" 0.10 C (0 . 65) (1 . 35) BASE PLANE ( 6X 0 . 30 ) SIDE VIEW SEATING PLANE 0.08 C C
( 6X 0 . 55 ) C (1 . 95) 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" 0 . 2 REF 5
TYPICAL RECOMMENDED LAND PATTERN
NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature.
11
FN6166.5 February 8, 2007

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